Analysis and optimization of heat sink design for high-power laser diodes. I. Conventional heat sink

The second part of the paper considers laser diodes with modified heat sink design aimed at reducing the device thermal resistance. Optimization of geometrical parameters of the heat sink has turned out ineffective because of a strong localization of the heat release region near the laser chip. Alternative ways for the thermal resistance reduction are discussed in terms of simulations. The maximum output power of the laser diodes limited by thermal effects is estimated.