Microwave microblocks sealing with high-frequency soldering

Developed technology sealing microblocks microwave made of aluminum alloys, using high-frequency (HF) soldering, which provides high speed and selectivity heating. Are methods select the frequencies of heating, evaluation of tension electromagnetic fields in the working area inductor, as well as the experimental temperature-time dependence of high-frequency soldering. A number of parameters of the inductor are calculated: the frequency of electromagnetic oscillations is in the range 440-2200 kHz; the effective power of HF heating for these frequencies is in the range 0,8 ÷ 2,0 kW. The temperature profile of the high-frequency soldering of the packages of the microwave microblocks and the intensity both inside the inductor and inside the microwave casing of the microblock were investigated. The developed technological process of hermetic sealing of microblock packages includes the operations: preparation of packages and covers for soldering, assembly of the casing in the device, high-frequency brazing, quality control of the soldered joint and hermetic sealing of the package. Experimental time dependences of the temperature in the HF solder zone on time, the magnetic field strength on the power of the HF generator, and the temperature of the substrate inside the housing are obtained.