Investigation of the curing process of the polymeric binder based on their dielectric parameters when creating a dimensionally stable thin-walled structures resistance to the negative space factors

The article focuses on the creation of thin-walled structures using a dimensionally stable integral partial crosslinked. Relevance of the work is due to the increasing requirements for aerospace structures, increase structural strength and reduce its weight. Using the method of partial cross-linked is possible to create integrated designs underweight, due to the absence of mechanical fasteners, and high structural strength is achieved by molding the various structural elements in one work cycle. The question of a dimensionally stable thin-walled structures made of polymeric composite materials, used in outer space, in terms of the degree of cure of the binder is considered. The degree of cure of the binder can be expressed in terms of the desired property of the final product. A brief description and comparison of modern methods of determining the degree of cure of the binder is given. It is shown that an advantage of the method of analysis is a dielectric capable of monitoring the curing process in real time. The theory of the method of the dielectric analysis to determine the extent of curing thermosetting, in particular epoxy resins used in the polymer composites is briefly discussed. The technological equipment with forced heat sink for the manufacture of integrated structures of polymeric composite materials by partial curing is used. As the coolant water was used. Experimental evaluation of performance tooling for forming integrated structures of polymer composite materials is made. The performance of tooling for forming integrated structures using partial cross-linked is shown. It is determined that for the method of partially curing the most appropriate method to determine the degree of cure is the dielectric analysis. The results can be used for the design and fabrication of integrated structures from polymeric composites, molded in one process cycle using the method of partially curing the binder.