Development solder alloys based on palladium the use of boron
Автор: Uskov Igor V., Sidelnikov Sergei B., Belyaev Sergei V., Uskov Danil I., Anikin Alexei I., Anikina Valentina I., Stolyarov Alexandr V.
Журнал: Журнал Сибирского федерального университета. Серия: Техника и технологии @technologies-sfu
Статья в выпуске: 3 т.6, 2013 года.
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Developed a palladium alloy solder containing boron. Developed the technology the preparation of the alloy, studied the mechanical characteristics and the effect of heat treatment on it. The possibility of a continuous casting solder ribbon and the use of automatic welding.
Palladium, solder, microstructure, melting, heat treatment, state diagram
Короткий адрес: https://sciup.org/146114742
IDR: 146114742
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