The thermal resistance of semiconductor devices. Coolers of power semiconductor devices

Автор: Evdokimov A.A.

Журнал: Теория и практика современной науки @modern-j

Рубрика: Основной раздел

Статья в выпуске: 4 (22), 2017 года.

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The article touches upon the problem of heating of the power semiconductor devices in their work. There are several cooling systems used to remove heat from the working valves. They are varied in design, type of chiller, type of the cooling medium and have its pros and cons. Modern transducer technology perspective is the use of evaporative cooling system with coolers in the form of heat pipes.

Power semiconductor devices, thermal resistance, heating valves, cooling system spp, coolers, evaporative tube

Короткий адрес: https://sciup.org/140271257

IDR: 140271257

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