Knowledge Base Architecture for Analyzing Defect Occurrence in Printed Circuit Assemblies
Автор: O.V. Chuprinova, Ya.A. Shchenikov
Журнал: Известия Самарского научного центра Российской академии наук @izvestiya-ssc
Рубрика: Машиностроение и машиноведение
Статья в выпуске: 3 т.27, 2025 года.
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The study aims to optimize data utilization in thermal imaging inspection to facilitate the implementation of preventive measures. To achieve this goal, the following tasks were addressed: сollect data on the thermal imaging inspection process and the personnel performing inspections; establish relationships between tables in the knowledge base; develop a framework for processing data to identify defects in printed circuit assemblies; analyze data on the frequency of specifi c defect occurrences to generate recommendations for preventive actions. Hypothesis: automating thermal imaging inspection processes necessitates the development of a knowledge base for effi cient storage and utilization of acquired data. The study employed SQL knowledge base simulation modeling. As a result, an informational model for the knowledge base was developed, which provides insights into the need for implementing preventive measures.
Printed circuit assembly, knowledge base, thermal imaging inspection, preventive actions
Короткий адрес: https://sciup.org/148331136
IDR: 148331136 | DOI: 10.37313/1990-5378-2025-27-3-189-194