Research the quality of soldering the microcircuits with face leads

The method of quality assurance at soldering the microcircuits with face leads at superficial installation of electronic units for space equipment is offered. At stage of technological preparation of production the special articles in addition to typical monitoring system to estimate quality of soldering by visual morpho-logical research and microanalysis of soldered leads zone is offered. Experimental data under stannum and lead maintenance in different areas of soldered connections are received. Homogeneity of soldering paste components is estimated.