Investigation of the properties of cured compound in the filling problems of high-voltage source of nutrition

Development and production of analog, digital and mixed high-reliability computing equipment requires improvement of quality at all stages of production. This work is devoted to research and improvement of technology of filling with a compound of elements of high-voltage equipment working as a part of highly reliable products of instrument-making. The object of the study is the modes of filling compound type 10-200. The aim of the study is to improve the quality of production and analysis of the causes of failures, improve the quality of filling compound used for filling high-voltage equipment. Objectives: to identify the causes and methods of reducing the formation of bubbles during polymerization or climatic tests. In the course of researches the best technological modes of filling and curing of compound 10-200 are determined.