Investigation of heat distribution in uhf transceiver module

The article deals with computer modeling of thermal processes in the transceiver modules (TM) in microelectronic execution. Also, the results of studies of the effect of the material and configuration through-plated holes in the substrate on the thermal conductivity. In the work at a given power released from the sample surface is obtained temperature distribution established during normal operation. Investigated three design variants TM performance, a comparison is made of the full model of TM on silicon and ceramics, also analyzed the results and conclusions.