Investigation of the effect of transverse bending deformation on the design of an elastic substrate with a horseshoe-shaped copper conductor

Features of creating elastic electronics are the use of highly elastic materials, such as polydimethylsiloxane, and a special form of metal conductors that can withstand stretching. The influence of mechanical deformations of transverse bending in an elastic carrier with horseshoe-shaped copper tracks with a supporting layer of polyimide is considered. From the results of numerical modeling, the maximum values of mechanical stresses in the conductor, the displacement values of the compound and the conductor along the axis having the opposite direction from the applied force, the corresponding patterns of stress distribution in the conductor and displacements in the compound, as well as the best option for the location of the polyimide relative to the metal in the same direction were determined bending load. A study of the adhesive properties of several organosilicon materials was carried out.