Methodology for synthesizing the topology of a radio frequency path node board

Автор: Novomeisky D.N., Piganov M.N., Luptsov A.A., Bogdanov D.S.

Журнал: Физика волновых процессов и радиотехнические системы @journal-pwp

Статья в выпуске: 3 т.28, 2025 года.

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Background. The relevance of the topic of this work is due to the need to reduce the complexity of the process of designing the topology of boards of film nodes of radio frequency and microwave paths. Aim. Development of a methodology for modeling and synthesizing parameters of film assemblies of radio frequency and microwave paths of electronic equipment based on the upgraded AWR Microwave Office Environment 15 design environment. Methods. The article discusses a method for synthesizing board topology, which includes the following basic operations and procedures: setting up test benches, analyzing source data, estimating required electrical parameter values, adaptive grid partitioning, modeling multiplexed signals, modeling element distortions, routing circuit tracing, verifying solutions using tables, evaluating a completed project using test benches, minimizing the distances between conductors, plotting and optimizing graphs. Development of the conductor methodology using the example of modeling and design of a directional loop coupler of RF and MV paths. Results. The topology of a directional loop coupler with a 10 GHz signal frequency has been synthesized for its implementation using thick-film technology on a 0,25 mm thick polycor and Du Pont 951 substrate. The frequency response of the coupler is built. Conclusion. The resulting topology meets the requirements of the technical specification. Experimental testing of the technique has shown that it can reduce the complexity of modeling the main characteristics of nodes by 20–40 % and reduce information resources by up to 30 %.

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Methodology, design, topology, directional loop coupler, modeling, synthesis operations, labor intensity

Короткий адрес: https://sciup.org/140312394

IDR: 140312394   |   УДК: 621.396   |   DOI: 10.18469/1810-3189.2025.28.3.49-55