Manufacturing technology chipboard using the amorphous silicon dioxide

The article discussed the features of the use of amorphous silica with a nanoporous structure as a modifier of adhesive compositions for chipboard. The purpose of this work: to study the influence modifier in the form of amorphous silica brand "Kovelos" 35/05 on the strength of the samples chipboard flexural and tensile perpendicular plasti boards. Experimentally determined, if the proportion of the additive increases from 0 % to 0.5 %, then the flexural strength increases from 31.6 MPa to 57.2 MPa (by 81 %). If the proportion of the additive is 1 %, the flexural strength increases from 31.6 MPa to 60.6 MPa (by 92 %). Under the same conditions, by increasing the amorphous of silica additives from 0 % to 0.5 % and the tensile strength perpendicularly to plate is increases from 0.99 MPa to 1.33 MPa (by 34 %). If the proportion of the additive is 1 %, then the strength is increased from 0.99 MPa to 1.42 MPa (by 43 %). So, the value of the technically efficient and economically feasible proportion of the additive: from 0.50 % to 0.70 % relative to the weight of the resin. It is important, if the normal manufacturing technology chipboard them provides sufficient strength, then the use of a modifier in the form of amorphous silicon dioxide will provide the same strength under reduced share of binder. This will reduce the toxicity of these chipboards.