The technology of ultrasonic formation of soldered connections of electrical boards with the control of the pressing force

The paper discusses the issues of technology for the formation of non-soldered connections of electrical boards using ultrasonic vibrations. A developed and patented device for the formation of ultrasonic longitudinal torsional vibrations is described, which makes it possible to significantly reduce the pressing force, modify the properties of the surface layers of parts and control the pressing force of contact pins.