Development of a binder for metallization of corundum substrates with Al₂O₃ more 85%

The results of the research are extremely relevant and are devoted to the development of the composition of metallization paste for printed microelectronics products with increased functionality. The currently existing compositions of metallization pastes, which are actively used for the manufacture of printed microelectronics products, have the disadvantage of the presence of imported materials. As a number of studies have shown, the Russian reagent base has great potential for replacing imported materials used in the composition of metallization pastes.In addition, in some cases, such a replacement can improve the characteristics of existing metallization pastes, significantly improve their printing properties, increase electrical conductivity, reduce the insulation resistance of ceramic materials, improve the quality of screen printing, as well as fully ensure import substitution and reduce dependence on foreign products.