Quality control of solder connections of electronic assemblies
Author: Ivanov Andrey, Piganov Mikhail
Journal: Известия Самарского научного центра Российской академии наук @izvestiya-ssc
Section: Информатика, вычислительная техника и управление
Article in issue: 4-7 т.18, 2016.
Free access
Failures of solder connections of surface mounting on multilayer printed circuit board were described. The questions of fatigue strength of solder connections were considered. engelmeyer’s models of quality and reliability and wilde’s mathematical models were analyzed. The test task of assessment of the adequacy of reliability model was offered and solved. The comparative data of reliability calculation results on program «Solder-1» with the parameters of the test task was received.
Electronic assembly, solder connection, solder, quality, reliability, fatigue strength, reliability models, calculation program, comparative evaluation
Short address: https://sciup.org/148204863
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