The development of a device for measuring the thickness of metal coatings in the process of manufacturing printed circuit boards

A device for controlling the thickness of metal coatings in the manufacturing process of thin-film microstrip printed circuit boards has been developed. A thickness measurement method is described that allows one to evaluate both single-layered and multilayer metal coatings, as well as variants of its introduction into the technological process. A functional diagram of the measuring device is described. The results of an experimental estimation of errors in the process of measuring the thickness of metal coatings by the method of local electrochemical analysis are given.