Composite multicomponent of gallium pastes-solders
Автор: Kazakov Vladimir S., Temnykh Evgeni V., Rastovtsev Pavel A., Potekhina Elena A.
Журнал: Журнал Сибирского федерального университета. Серия: Техника и технологии @technologies-sfu
Статья в выпуске: 3 т.5, 2012 года.
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Contact interaction of copper-zinc and copper-silver alloys is investigated with eutectics melts of the system Ga-Zn as composite components of gallium pastes - solders have been revealed. Interaction products have been determined depending on the structure and temperature of contacting components. Structures of developed new low temperature solders have been approved on the basis of gallium.
Gallium, pastes - solders, brass, copper-silver alloys, interaction, eutectic
Короткий адрес: https://sciup.org/146114649
IDR: 146114649
